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The device is a Fusion Field Programmable Gate Array (FPGA) Integrated Circuit, model number 60. It features 27648 pins and has a packaging style known as 180-WFQFN with dual rows, including an exposed pad.
Product Specifications:
Series
Fusion
HTSUS
8542.39.0001
ECCN
3A991D
Standard Package
184
Base Product Number
AFS090
Manufacturer
Microsemi Corporation
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Package
Tray
Other Names
AFS090-1QNG180 | 150-AFS090-1QNG180