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Shop By BrandsAFS090-2QNG180I
:
FPGA Integrated Circuit with 60 I/Os, Package 27648, Power Dissipation: 180W, Packaging Type: Dual Rows, Exposed Pad.
Product Specifications:
Series
Fusion
Other Names
AFS090-2QNG180I | 150-AFS090-2QNG180I
HTSUS
8542.39.0001
ECCN
3A991D
Standard Package
184
Base Product Number
AFS090
Manufacturer
Microsemi Corporation
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Package
Tray