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Shop By BrandsAFS250-2FGG256
:
The chip is a Fusion Field Programmable Gate Array (FPGA), packaged as an Integrated Circuit (IC) with the designation number 114. It has a large memory capacity of 36864 and is mounted on a 256-LBGA (Land Grid Array) package.
Product Specifications:
Series
Fusion
HTSUS
8542.39.0001
ECCN
3A991D
Manufacturer
Microchip Technology
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Product Number
AFS250
REACH Status
REACH Unaffected
Package
Tray
Standard Package
90