AFS250-2QNG180



FPGAs offer the flexibility of reconfigurable logic, making them ideal for a wide range of applications. The Fusion Field Programmable Gate Array (FPGA) is specifically designed to meet the demands of high-performance systems with its 65,368 configurable elements and robust heat dissipation capabilities through the use of a 180-WFQFN package with dual rows and an exposed pad for enhanced thermal management.

Product Specifications:

Series
Fusion
HTSUS
8542.39.0001
ECCN
3A991D
Standard Package
184
Manufacturer
Microsemi Corporation
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Product Number
AFS250
Package
Tray
Other Names
150-AFS250-2QNG180 | AFS250-2QNG180

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