.png){kind=logo}
Deal Of The Day
Top Sellers
Top Trending
New Arrivals
Shop By BrandsAFS250-QNG180I
:
FPGA Integrated Circuit with 65,368 Active Elements in a 180-WFQFN Package, Featuring Dual Rows and an Exposed Pad.
Product Specifications:
Series
Fusion
HTSUS
8542.39.0001
ECCN
3A991D
Standard Package
184
Other Names
150-AFS250-QNG180I | AFS250-QNG180I
Manufacturer
Microsemi Corporation
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Product Number
AFS250
Package
Tray