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The IGLOO Field Programmable Gate Array (FPGA) IC has the following specifications: package type 97, package quantity 110592, die size 13824, and ball grid array (BGA) package style 144-LBGA.
Product Specifications:
Series
IGLOO
Standard Package
160
Base Product Number
AGL600
HTSUS
8542.39.0001
ECCN
3A991D
Manufacturer
Microchip Technology
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
Other Names
1100-1116 | AGL600V5FGG144I
Package
Tray