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The Ic Crypto TPM TSSOP is a specialized type of semiconductor package designed to accommodate the specific requirements of Trusted Platform Module (TPM) chips, which are used to provide secure cryptographic functions in various devices. This packaging format combines the compactness and efficiency of a Thin Shrink Small Outline Package (TSSOP) with the enhanced security features necessary for TPM applications.
Product Specifications:
Manufacturer
Microchip Technology