M1AFS250-1PQG208



The device is a Fusion Field Programmable Gate Array (FPGA) integrated circuit, denoted as IC 93 36864 in the package type 208-BFQFP.

Product Specifications:

Series
Fusion
HTSUS
8542.39.0001
ECCN
3A991D
Base Product Number
M1AFS250
Manufacturer
Microsemi Corporation
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Standard Package
24
REACH Status
REACH Unaffected
Package
Tray
Other Names
150-M1AFS250-1PQG208 | M1AFS250-1PQG208

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