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Shop By BrandsM7AFS600-2PQG208
:
The device is a Fusion Field Programmable Gate Array (FPGA) Integrated Circuit, packaged in the 208-Ball Fine Pitch Quad Flat Package (BFQFP).
Product Specifications:
Series
Fusion
HTSUS
8542.39.0001
ECCN
3A991D
Manufacturer
Microsemi Corporation
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Standard Package
24
REACH Status
REACH Unaffected
Package
Tray
Other Names
M7AFS600-2PQG208 | 150-M7AFS600-2PQG208
Base Product Number
M7AFS600