MPF200T-1FCG784I



The PolarFire Field Programmable Gate Array (FPGA) is a type of Integrated Circuit (IC), denoted as 364. It has a package designation of 13619200 and a die size of 192000. The device comes in a 784-Ball Bump Grid Array (BBGA), also known as a Flip Chip Ball Grid Array (FCBGA).

Product Specifications:

HTSUS
8542.39.0001
Standard Package
1
Series
PolarFire
ECCN
3A991D
Manufacturer
Microchip Technology
RoHS Status
ROHS3 Compliant
REACH Status
REACH Unaffected
Package
Tray
Base Product Number
MPF200

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