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A high-performance Integrated Circuit (IC), specifically a Fusion Field Programmable Gate Array (FPGA) with the designation "676-BGA", features a dense array of programmable logic components, typically used for complex digital signal processing, high-speed data transfer and advanced computational tasks. Its compact Ball Grid Array (BGA) packaging facilitates efficient heat dissipation and allows for smaller form factor designs in various applications including telecommunications, scientific research, and industrial automation. The IC's performance specifications include a density of 252 units per package, with a total pin count of 276480.
Product Specifications:
Series
Fusion
Base Product Number
M1AFS1500
HTSUS
8542.39.0001
ECCN
3A991D
Manufacturer
Microchip Technology
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
Package
Tray
Standard Package
40