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Shop By BrandsM1AFS250-QNG180
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The product is a Fusion Field Programmable Gate Array (FPGA) Integrated Circuit (IC), specifically the 65-36864 model in a 180-WFQFN package with dual rows and an exposed pad.
Product Specifications:
Series
Fusion
HTSUS
8542.39.0001
Other Names
M1AFS250-QNG180 | 150-M1AFS250-QNG180
ECCN
3A991D
Standard Package
184
Base Product Number
M1AFS250
Manufacturer
Microsemi Corporation
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Package
Tray